All-Around High Speed Bank Milling & Embedding Combi Machine

XDL-DME500 machine Is designed specifically for Conductive Hot Melting Adhesive Tape Technology, a combi production line of High Speed Card Milling, Module Detection, Laminating and Module Embedding in one operation. Conductive Hot Melting Adhesive Tape Technology can replace the traditional metal welding conduction mode, and can greatly improve the output and yield. Integrating with Double Milling Stations, Color Sensor Detection, Double Card Detection, Depth Detection, Perforation Detection, Chip Presence Detection, Module Flatness Detection ATR Detection, Module OCR Inspection,High Speed Cleaning,Tape Punching, Online Lamination, Hot Press, Cold Press, Chip Module Punching and Embedding as one of the functional production line. SDK and application interface for secondary development of devices can be provided to meet customers individual requirements. The device is specially designed for the production of the ISO standard contact and ISO standard dual interface cards, such as: Bank card, ID card, Credit card, IC card, VIP card and etc.