SIM card milling and Embedding machine

 The function as follows:

– Online Glue Lamination

– Plastic Card Milling

– Cavity Depth Measurement

– Plastic Card Embedding

– Module Height Measurement after Embedding

– ATR Testing

1.1 Machine Throughput:

– For ISO Single SIM 5000-5500 cards per hour

– For Half card Eco-SIM 8000-8500 SIM per hour

– For quarter card 8000-8500 SIM per hour

Only one set module punching tool is capable for producing:

quarter card, half card and ID-1 card with single module.

1.2 Online Glue Lamination

Online glue lamination is installed on machine XDL-SME400. This function could be enabled or disabled simply by

pressing the button on Human Machine Interface (HMI).

The online lamination of machine is compliant to produce and accept

– any kind of module tape, including: M2/M3/M4/M5 and any kind of 6

pins or 8 pins module tape, and F-Cos modules.

– any kind of hot melt adhesive tape, including Scapa, Nitto, Telsa… etc.

Along with the machine XDL-SME400, you will receive 1 set adhesive tape punching tool and 1 pcs lamination plate

Shape of Adhesive Glue Punching and Lamination Plate could be customized following the drawing offered by customer.

1.3 Card Input Magazines

There are two magazines installed on the machine XDL-SME400 for card input.

Whenever one of the input magazines is empty, the machine will switch to another magazine automatically.

1.4 Color Sensor

Color sensor is installed on machine, this is for card orientation check. After color sensor being properly set, the machine will automatically stop when different color of card is detected.

1.5 Double Card Detection

Double card detection function is equipped on machine to prevent two or more cards is loaded. This is the standard function to prevent loading 2 cards onto transfer belt.

1.6 Card Milling Platform A and B

Imported milling spindle motor is installed on machine. With a very small size of spindle motor by using air cooling system, the rotation speed could reach up to 40000 circles per minutes.

1.7 Vacuum Cleaning

There is vacuum cleaning installed on machine to efficiently evacuate milling rubbish.

1.8 Cavity Depth Measurement A and B

Cavity depth check is installed on machine. After user sets up the proper range of card cavity depth, every card which

is not compliant to the depth settings will be automatically rejected into reject bin.

1.9 Module Punching and Pick & Place Arm

For XDL-SME400, 1 set of module punching tool is capable to produce ID-1 ISO single SIM, half card and quarter card.

Whenever the user wants to switch production from half card to quarter card,

or switch from ISO single SIM to half card, no need to change module punching tool.

The module pick and place platform is X and Y movable.

This make the machine XDL-SME400 is able to finish quarter card or half card embedding in one run. (in one pass).

Original THK assembling is installed for module pick & place arm.

1 set module punching tool will be shipped along with the machine XDL-SME400.

1.10 Pressing Group A and B

For pressing group A, there will be 3 hot pressers and 1 cool presser.

For pressing group B, it is the same.

In total, 6 hot pressers and 2 cool pressers will be shipped along with machine.

1.11 Module Height Measurement

Module height measurement is installed on machine. This is to check height of module compared to plastic card.

Any card which is not compliant to the settings will be automatically rejected into reject bin.

1.12 ATR Testing

ATR testing function is installed to check if card is mute after embedding.

Any mute card will be rejected automatically.

1.13 Card Output Magazines:

There are two magazines installed on the machine XDL-SME400 for card input. They are for automatic switch when

one magazine is full.